PAIOS-A, a superior system on chip for DAB application
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Environmental Matter : RoHs CompliancePb Free Compliance

Chip Overview :
 PAIOS-A is a superior system on chip for DAB application.
It fully supports both the Eureka-147 DAB consists of flexible hardware COFDM demodulator and RADIO DSP.
Single channel DAB application is supported with only this one chip.
Several interfaces such as SPI, I2C and are implemented providing customers with more flexibility
The PAIOS-A integrates the Tensilica 330HiFi DSP, offering the low-power, high-performance audio DSP cores, support enhanced digital audio applications.
The 330HiFi DSP core eliminates the need for the audio companion processors normally required for audio-based applications.
In addition a DAB RF tuner is integrated with RF SOC technology.
By removing the need for costly application coprocessors and memory subsystems and a RF tuner, the PAIOS-A chipset solution reduces BOM costs.
The PAIOS-A chipset solution integrates DAB technologies into a single chip.


 Differential 12bits ADC and Digital Tuner interface for external RF device
 Outstanding SFN, Mobility, Adjacent and Co-channel rejection
 Ideal C/N Performance and Superior Fading Performance
 Auto detect of transmission mode and guard
 Decoding Information: FIC and MSC
 Low power consumption: 350mW
 32-bits RISC architecture with integrated 24-bits audio processing instructions
 Antenna Diversity (MRC) support with external DAB front-end solution
 Dual MACs can operate as 32 x 16-bits/24 x 24-bits
 4KByte Instruction and 8KByte data 2-way set associative caches
 64KByte data RAM and 192KByte SRAM for system process
 16MByte Mobile SDRAM stacked for high technology audio codec process and data service
 10 x 10 mm, 0.8 mm pitch, 128-pin Fine pitch BGA technology

 Automotive Digital Radio System for receiving single channel DAB ensemble
 Boom Box and Audio component system
 Bluetooth Speaker system for Digital Radio
 Kitchen Radio application

Ordering Information
Order Number


Stacked SDRAM Size


Package Information

Ball Pitch


Body Size

10mm x10mmx1.3mm

Pin Count (Type)

128 pins (FBGA)

Supply Voltage




2.7 ~ 3.6V

Core Clock Speed

300MHz (TBD)

Operation Temperature

-40 ~ +85oC (TBD)

Storage Temperature

-40 ~ +125oC