PAIOS-AD, 1-ch DAB Receiver All in One [ RF + Demod + DSP ]
SoC with One DAB Tuner for  Audio or Data or BGS
 
 
 
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Environmental Matter : RoHs CompliancePb Free Compliance

Chip Overview :
 PAIOS-AD is a superior system on chip for DAB applications. It fully sup ports both the E ureka 147 DAB consists of flexible hardware COFDM demodulator and R adio/Audio DSP Several interfaces such as SPI, I2 C and UART are implemented providing customers with more flexibility.
The PAIOS-AD integrates the Tensilica HiFi EP DSP, offering the low-power, high-performance audio DSP core, support enhanced digital audio applications. The DSP EP core eliminates the need for the audio companion processors normally required for audio-based applications. In addition, dual DAB RF tuner are integrated with RF SOC technology. By removing the need for costly application coprocessors and memory subsystems and dual RF tuner, the PAIOS-AD chipset solution reduces BOM costs. The PAIOS-AD chipset solution integrates both DAB into a single chip.

 

Features
  Multi-standards support: DAB / DAB+ / DMB-A
  Single DAB tuner is integrated and single Digital I/Q Tuner interface for external RF device
  Outstanding SFN, Mobility, Adjacent and Co-channel rejection
  Ideal C/N Performance and Superior Fading Perfor mance
  Decoding In formation: FI C and MSC
  Low power consumption: MAX 75 0 mW
  32-bits RISC architecture with integrated 24-bits audio processing instructions
  Modeless switching between 16-, 24-, and 64-bits dual-issue instructions
  Dual MACs can operate as 32 x 24-bits
  16MByte Mobile SDRAM stacked for high technology audio codec process and data service
  10 x 10 mm2, 0.65 mm pitch, 179-pin Fine pitch BGA technology.

Application
  Automotive Digital Radio System for receiving single channel DAB signal
  Aftermarket car radio and audio system
  Boom Box and Audio componen t system
  Smart Speaker system for Digital Radio
  Kitchen Radio application

Ordering Information
Order Number

PAIOS-AD

Stacked SDRAM Size

16MByte

Package Information

Ball Pitch

0.65mm

Body Size

10mm x10mmx1.2mm

Pin Count (Type)

179 pins (FBGA)

Supply Voltage

Core

1.2V

I/O

3.0 ~ 3.3V

Operation Temperature

-40 ~ +85oC (TBD)

Storage Temperature

-50 ~ +150oC